• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:SE1051101A1
    申请号:SE1051101
    申请日:2010-10-22
    公开日:2012-04-23
    发明作者:Anders Cederberg；Peter Arndt；Klas Bertilsson；Anders Nyander
    申请人:Alfa Laval Corp Ab；
    IPC主号:
    专利说明:

    15 20 25 30 35 devices and connections are subjected to aggressive cleaning, possibly at high pressure, which can lead to the devices failing. The large number of connections places high demands on drug-free electrical contacts.
    An object of the present invention is to obviate the problems discussed above and to provide a reliable plate heat exchanger having a large number of heat exchanger plates with such a device on a large number or even all of the heat exchanger plates.
    This object is achieved by means of the initially indicated heat exchanger plate which is characterized in that the heat exchanger plate comprises a communication module comprising an electronic circuit connected to the device, the communication module also comprising communication means allowing communication of said signal with a main unit via at least communication module of another heat exchanger plate in the plate package.
    With such a heat exchanger plate, it is possible to manufacture a plate heat exchanger with a reliable connection to the device even in the case that a large number of heat exchanger plates are included. The plate heat exchanger can be manufactured in a simple manner as no connection cables are required for the communication with each of the devices. The freedom to position the communication module is great because it does not have to be available for connection cables. The communication module can thus be positioned in a place which offers good protection for the module, and at which it is not exposed to aggressive cleaning.
    According to an embodiment of the invention, the communication module is designed to be comprised of a communication bus which is operated in accordance with a suitable communication protocol, such as a serial bus protocol. According to a further embodiment, the communication means comprise at least one primary contact element located on a primary side of the heat exchanger plate, and at least one secondary contact element placed on an opposite secondary side of the heat exchanger plate. Such contact elements allow communication between the device and the main unit from a communication module to the adjacent communication module and so on.
    According to a further embodiment, the device comprises a sensor designed to sense at least one parameter and to generate a signal depending on the parameter. Such a sensor may comprise at least one of a pressure sensor, a temperature sensor, a humidity sensor, etc.
    According to a further embodiment, the device comprises a voltage generator designed to generate a voltage which is applied to the heat exchanger plate. Such a voltage generator can be arranged to generate a voltage to the heat exchanger plate in order to avoid, reduce or even remove coating from the plate.
    According to a further embodiment, the communication module is arranged in the edge area. In the edge area, the communication module is suitably protected from the media flowing in the plate heat exchanger of the plate heat exchanger. The communication module can also be easily accessed from the outside in this position.
    According to a further embodiment, the heat exchanger plate comprises a packing path, which extends around the heat transfer area between the heat transfer area and the edge area and is designed to receive a gasket, and a further packing path, which extends on the edge area and on which a further gasket extends , wherein a space is formed between the packing path and the further packing path, in which space the communication module is arranged. With such a packing arrangement, the communication module is suitably protected also from external influences, such as cleaning liquids. According to a further embodiment, the heat exchanger plate comprises a number of port holes, which extend through the heat exchanger plate and are located inside the edge area, and preferably inside the packing path, and in the vicinity of the edge area.
    According to a further embodiment, the heat exchanger plate comprises a cut-out in the edge area, wherein the communication module is arranged in the cut-out. Such a cut-out, in the form of an opening or a recess, provides an advantageous position for the communication module, in particular for allowing the primary contact element to be arranged on the primary side of the heat exchanger plate and the secondary contact element on the opposite secondary side of the heat exchanger plate. The cut-out can extend to the edge or be arranged inside the edge of the heat exchanger plate. The object is also achieved with the initially stated plate heat exchanger which comprises a plurality of heat exchanger plates stated above and arranged next to each other to define several first plate gaps for a first medium and several second plate gaps for a second medium.
    According to a further embodiment, the communication modules and the main unit are comprised of a communication bus which is operated in accordance with a suitable communication protocol.
    According to a further embodiment, the communication bus is a serial bus. Such a serial bus is suitable for allowing communication between the device and the main unit via successively arranged communication modules which communicate with each other via the primary contacts on one side of the heat exchanger plate and the secondary contacts on the other side of the heat exchanger plate. According to a further embodiment, the communication modules are arranged in a daisy-chain circuit.
    According to a further embodiment, the communication modules are arranged one after the other in the communication bus and have a respective address in the communication bus, which corresponds to the position of the communication module in the plate heat exchanger. In other words, the order of the communication modules, and thus the order of the heat exchanger plates, in the plate heat exchanger determines the address of the respective communication module.
    According to a further embodiment, each communication module comprises a switch means designed to be closed when the communication module is initiated, whereby the adjacent subsequent communication module is connected to the communication bus and the main unit. The communication modules are thus arranged in a daisy-chain circuit.
    Each communication module comprises a switch means designed to be in an open or closed position, the communication module being initiated when the switch means is switched to the closed position, whereby the adjacent subsequent communication module is connected to the communication bus and the main unit. Advantageously, in the closed position, the switching means of the communication module may be arranged to connect the communication module to the communication bus and the main unit, whereby the main unit allows transmission of an initiation signal via this communication module to an adjacent subsequent communication module so that this adjacent communication module the communication bus and the main unit.
    According to a further embodiment, the main unit is arranged on the plate heat exchanger. The main unit may comprise additional communication means for communication with additional systems, such as an overall control and / or monitoring system, via suitable cables or in a wireless manner. The main unit may also include a display or the like to display information to a user.
    BRIEF DESCRIPTION OF THE DRAWINGS The present invention will now be explained in more detail with the aid of a description of various embodiments and with reference to the accompanying drawings.
    Fig. 1 shows a front view of a plate heat exchanger comprising a plurality of heat exchanger plates according to the first embodiment of the invention.
    Fig. 2 shows a side view of the plate heat exchanger along the line ll-ll in Fig. 1.
    Fig. 3 shows a front view of a heat exchanger plate of the plate heat exchanger in Fig. 1.
    Fig. 4 shows a front view of a part of the heat exchanger plate in Fig. 3.
    Fig. 5 shows a sectional view along the line V-V in Fig. 4.
    Fig. 6 schematically shows a communication module of the heat exchanger plate in Fig. 3.
    DETAILED DESCRIPTION OF DIFFERENT EMBODIMENTS OF THE INVENTION Figures 1 and 2 show a plate heat exchanger comprising a plurality of heat exchanger plates 1 forming a plate package. The heat exchanger plates 1 are arranged next to each other to define several first plate gaps 2 for a first medium and several second plate gaps 3 for a second medium. The first plate gaps 2 and the second plate gaps 3 are arranged in an alternating order in the plate package. The heat exchanger plates 1 of the plate package are pressed against each other between a frame plate 4 and a pressure plate 5 by means of clamping bolts 6. In the embodiments shown, the plate heat exchanger 4 comprises port hole channels 7 forming an inlet and an outlet for the first medium and an inlet and an outlet for the second medium. One of the heat exchanger plates 1 is shown in Fig. 3. The heat exchanger plate 1 comprises a heat transfer area 10, an edge area 11, which extends around and outside the heat transfer area 10.
    The edge area 11 comprises the outer surrounding edge of the heat exchanger plate 1. The heat exchanger plate 1 also comprises a packing web 12, which extends around the heat transfer area 10 between the heat transfer area 10 and the edge area 11. A gasket 13 is arranged on the gasket web 12 and extends around and encloses heat transfer area 10.
    The heat exchanger plate may also comprise a further packing path 12 ', which extends on the edge area 11. A further packing 13' is arranged on the further packing path 12 ', see Fig. 4. As can be seen in Fig. 4, a space 14 formed between the gasket 13 and the further gasket 13 '. The space 14 is closed in relation to the surroundings and in relation to the plate gaps 2, 3. In the embodiments shown, four gate holes 15 are arranged and extend through the heat exchanger plate 1. The gate holes 15 are located inside and in the vicinity of the edge area 11. The gate holes 15 are aligned with the gate hole channels 7.
    In the embodiments shown, the plate heat exchanger is thus mounted and held together by means of the clamping bolts 6 and the gaskets 13, 13 '. It should be noted, however, that the invention is also applicable to plate heat exchangers of other types. the heat exchanger plates 1 can, for example, be permanently connected to each other by means of welding, such as laser welding or electron beam welding, gluing or even soldering. An example of an alternative mounting of the heat exchanger plates 1 is a so-called semi-welded plate heat exchanger where the heat exchanger plates are welded to each other in pairs, whereby the pairs of the heat exchanger plates can be pressed against each other by means of clamping bolts with gaskets arranged between the plates. Each heat exchanger plate 1 comprises a communication module 20 which comprises an electronic circuit 21, see Fig. 5, for example in the form of a chip. The electronic circuit 21 is enclosed or embedded in a housing 22, which protects the electronic circuit 21 from being affected by external gases and liquids.
    In the embodiments shown, the communication module 20 is arranged in the edge area 11. In the edge area 11, the communication module 20 is suitably protected from the media flowing in the plate gaps 2, 3 by the plate heat exchanger. Furthermore, the communication module 20 in this position is easily accessible from the outside as can be seen in Fig. 3. In the variant shown in Fig. 4, however, the communication module 20 is arranged in the space 14. In the space 14 the communication module 20 is enclosed by the gasket. 13 and the additional gasket 13 'and thus separated from the environment. The heat exchanger plate 1 comprises a cut-out 23 in the form of an opening or a recess. The cut-out 23 is arranged in the edge area 11, for example in the space 14 as can be seen in Fig. 4. The communication module 20 is arranged in the cut-out 23 which provides an advantageous position for the communication module 20. The cut-out 23 can extend to the edge or be arranged inside the edge of heat exchanger plate 1.
    Each heat exchanger plate 1 comprises a device 25 which is designed to receive or generate a signal. In the embodiments shown, the device 25 comprises or consists of a sensor for sensing a parameter, for example a temperature sensor, a pressure sensor or a humidity sensor, and for generating a signal depending on the value of the sensed parameter. The sensor, or a sensor probe of the sensor, may be made of an electrically conductive material in the form of at least one wire, a strip, a blade or a net. The sensor, or sensor probe, may be mounted on or arranged on the heat exchanger plate 1 in the area where the parameter is to be sensed, for example in the heat transfer area 10. The sensor, or sensor probe may comprise an insulating layer which insulates the sensor , or the sensor probe, from electrical contact with the heat exchanger plate 1.
    The device 25 communicates with, and in the embodiments shown is connected to, the electronic circuit 21 of the communication module 20 so that the signal can be communicated to or from the device 25. in the case of a sensor, the signal is communicated to the communication module 20.
    The communication module 20 also includes communication means that allows communication of the signal with a main unit 30 via at least one communication module 20 of another heat exchanger plate in the plate package. The main unit 30 comprises a processor of some suitable type. In the embodiment shown, the main unit 30 is mounted on the plate heat exchanger, for example on the frame plate 4 as indicated in Figs. 1 and 2.
    The communication means of the communication module 20 of the heat exchanger plate 1 and the main unit 30 form or comprise a communication bus which is operated according to a suitable communication protocol. In the embodiments shown, the communication bus is a serial bus. The communication in the communication bus is initiated, monitored and controlled via or with the main unit 30.
    In the first embodiment, each communication module 20 also comprises a suitable number of primary contact elements 31 placed on a primary side 20 'of the communication module 20 and on a primary side of the heat exchanger plate 1, and secondary contact elements 32 placed on an opposite secondary side 20' of communication module 20 and on a secondary side of the heat exchanger plate 1. In the embodiment shown in Figs. 5 and 6, the communication module 20 comprises three primary contact elements 31 and three secondary contact elements 32. When the heat exchanger plates 1 are pressed against each other, the primary contact elements 31 of one of the heat exchanger plates 1 to be in electrical contact with the secondary contact element 32 of an adjacent heat exchanger plate 1, as can be seen in Fig. 5. In the first embodiment, the primary contact elements 31 designed as spring means which ensure a good electrical contact with corresponding secondary contact elements 32 when the exchanger plates 1 are pressed against each other.
    The main unit 30 may comprise corresponding secondary contact elements 32, which are arranged on or extend to the inside of the frame plate 4. These secondary contact elements 32 can be brought into electrical contact with the primary contacts 31 of the outermost communication module 20 when the plate heat exchanger is assembled.
    In the embodiments shown, a first pair of primary contacts 31 and secondary contacts 32 of a communication module 20 are provided for a power line 33 for supplying electrical power to the communication module 20. A second pair of the primary contact 31 and secondary contacts 32 is provided for a signal line 32 for various signals to be transmitted. A third pair of the primary contact 31 and the secondary contacts 32 are provided for a ground wire 35 for connecting the communication module 20 to ground.
    The communication module 20 may comprise only a primary contact element 31 and only a secondary contact element 32, whereby the electrical connection to ground can be provided via the heat exchanger plate 1. The power and signal line can be combined into a single line, for example using different current levels for power and signaling. The communication module 30 may also comprise two, four or more primary contact elements 31 and secondary contact elements 32.
    The communication modules 20 are designed to be mounted or connected to each other when the heat exchanger plates are arranged next to each other in the plate package. The housing 22 of each communication module 20 includes a surrounding flange 36 extending from the primary side 20 'and a surrounding recess 37 on the secondary side 20'. When the heat exchanger plates 1 are pressed together, a recess 37 of a communication module 20 allows the secondary side 20 "of this communication module 20 to fit inside the surrounding flange 36 of the adjacent communication module 20 as can be seen in Fig. 5. In this way a closed space 38 is created between the primary side 20 'of a communication module 20 and the secondary side 20' of the adjacent communication module 20. The primary contact elements 31 and see the secondary contact elements 32 which are in electrical contact with each other are thus enclosed in the enclosed space 38 and protected from the environment. The fit between the adjacent communication modules 20 is preferably designed to be tight to prevent any liquid from penetrating the closed space 38. Advantageously, a gasket 39, or some other suitable sealing means, may be provided between the surrounding recess. 37 and the surrounding flange 36 in order to achieve a good sealing of the closed space. According to a further alternative, the housing 22 of the communication module 20 may be made of a soft flexible material, such as an elastic polymeric material, which provides a sealing function between the recess 37 and the flange 36.
    Signals from each device 25 can thus be communicated to the main unit 30 via the respective communication module 20 and the communication bus. The main unit 30 is thus designed to receive and process signals from the devices 23 of all heat exchanger plates 1. The main unit 30 may comprise a display 40 for displaying information to a user, see Fig. 1.
    The main unit 30 may also include means for communication with other systems, such as an overall control and monitoring system.
    The communication bus, which is operated according to a suitable serial communication protocol, is designed to allow the communication between the device 25 and the main unit 30 via the communication modules 20. The communication modules 20 are arranged one after the other so that the signal is transmitted between the main unit 30 and the communication module and device 25 via the communication modules arranged between the main unit 30 and the communication module 20 in question.
    The communication module 20 is thus arranged in succession in the communication bus and has a respective address in the communication bus, which corresponds to the position of the communication module 20 in the plate heat exchanger. In other words, the order of the communication modules 20 in the plate heat exchanger determines the address of the respective communication module 20.
    Each communication module 20 comprises a switch means 41, see Fig. 6, which is designed to be open before the communication bus has been initiated and started, and to be closed when the communication module 20 is initiated by means of a signal from the main unit 30. The communication modules 20, or the electronic circuits 21 of the communication modules 20, are arranged in a daisy-chain circuit.
    When one of the communication modules 20 has been initiated, the switch means 41 of this communication module 20 is closed so that it is connected to the communication bus and the main unit 30.
    The main unit 30 then transmits an initialization signal via this communication module 20 to the adjacent subsequent communication module 20 so that this adjacent communication module 20 is connected to the communication bus and the main unit 30. This is repeated until no more uninitiated communication modules 20 respond to the initialization signal. The main unit 30 now knows the order in which the communication modules 20 are positioned and the communication module 20 can thus be identified and addressed by the main unit 30 by means of its position in the plate package. Consequently, no unique identification code is required for each communication module 20 since the communication bus and the individual communication modules 20 are automatically configured during initialization and start-up.
    This means that all communication modules 20 can be identical. Furthermore, this has the advantage that any heat exchanger plate 1 with a communication module 20 can be arranged in any position in the plate heat exchanger since its address in the communication bus is automatically given during the initialization.
    As mentioned above, the main unit 30 initiates the communication bus and provides addresses to the communication modules 20.
    Most of the logical signal handling and alarm handling can be done by means of the main unit 30. This reduces the complexity and cost of the communication modules 20, and thus of the heat exchanger plates 1. It also reduces the amount of information to be sent via the communication unit. tionsbussen. For example, a sensor of the device 25 can communicate only the current value of the parameter sensed while the alarm limit and the identification of alarms are handled by the main unit 30. In this way, it is easy to change alarm limits. Thanks to the unique address of each communication module 20, it is possible for the main unit 30 to notify the operator, for example via the display 40 or the overall control or monitoring system, not only that an alarm has occurred but also to indicate on which plate the alarm has - rerats.
    According to another embodiment, the device 25 comprises a voltage generator which is designed to generate a voltage which can be applied to the heat exchanger plate 1. Such a voltage can be applied in order to avoid or remove coating on the heat exchanger plates 1, especially in the heat transfer area 10. In this embodiment the communication bus is to transmit the voltage from the main unit 30, or any suitable voltage source connected to the main unit 30, to the individual communication modules 20 with the respective heat exchanger plate 1.
    In a further embodiment, the heat exchanger plates 1 are double-walled plates formed by two adjacent plates which are pressed to be in contact with each other. With such a double-walled plate, the device 25, for example in the form of a sensor of the above-mentioned type, can be arranged between the adjacent plates of the heat exchanger plate 1.
    The invention is not limited to the embodiments shown but can vary and be modified within the scope of the following claims.
    权利要求:
    Claims (5)
    [1]
    A heat exchanger plate for a plate heat exchanger, comprising a heat transfer area (10), an edge area (11) extending around and outside the heat transfer area (10), and a device (25) configured to receive or generate a signal, characterized in that the heat exchanger plate comprises a communication module (20) comprising an electronic circuit (21) connected to the device (25), the communication module (20) also comprising communication means allowing communication of said signal with a main unit (30). ) via at least one communication module (20) of another heat exchanger plate (1) in the plate package.
    [2]
    The heat exchanger plate according to claim 1, wherein the communication module (20) is designed to be comprised of a communication bus operated in accordance with a suitable communication protocol.
    [3]
    A heat exchanger plate according to any one of claims 1 and 2, wherein the communication means comprises at least one primary contact element (31) located on a primary side of the heat exchanger plate (1), and at least one secondary contact element (32) placed on an opposite secondary side of the heat exchanger plate (1).
    [4]
    A heat exchanger plate according to any one of the preceding claims, wherein the device (25) comprises a sensor designed to sense at least one parameter and generate a signal depending on the parameter.
    [5]
    Heat exchanger plate according to any one of the preceding claims, wherein the device (25) comprises a voltage generator designed to generate a voltage applied to the heat exchanger plate (1).
    类似技术:
    公开号 | 公开日 | 专利标题
    SE1051101A1|2012-04-23|Heat exchanger plate and plate heat exchanger
    JP5903534B2|2016-04-13|Multi-configurable scalable redundant battery module with multiple fault tolerance
    US20150255834A1|2015-09-10|Battery cell with integrated sensing platform
    US20140212695A1|2014-07-31|Flexible printed circuit as high voltage interconnect in battery modules
    CN105939152A|2016-09-14|Circuit arrangement and method for gate-controlled power semiconductor devices
    CN104470271B|2018-03-16|The industrial process-field device of electronic module with moisture-proof sealing
    US10847776B2|2020-11-24|Conductive module and battery pack
    JP2017533546A|2017-11-09|Battery system
    US9631997B2|2017-04-25|Apparatus for measuring a pressure, a method for manufacturing an apparatus for measuring a pressure and a battery
    JP2018155622A|2018-10-04|Pressure sensor
    JP2014107425A|2014-06-09|Liquid-cooled apparatus
    ES2522869T3|2014-11-18|A heat exchanger plate and a plate heat exchanger
    ES2444018A1|2014-02-21|Battery comprising a plurality of rechargeable cells arranged in a matrix
    SE537096C2|2015-01-07|Wireless sensor for measuring hydraulic pressure
    KR100811090B1|2008-03-06|Smart junction box
    JP2020140814A|2020-09-03|Temperature sensor, battery module and battery pack
    CN105206785A|2015-12-30|Apparatus for a battery module
    WO2021085351A1|2021-05-06|Power storage module
    JP3786659B2|2006-06-14|pressure switch
    同族专利:
    公开号 | 公开日
    ES2739895T3|2020-02-04|
    AU2011318648A1|2013-05-02|
    SE535236C2|2012-06-05|
    KR101453232B1|2014-10-22|
    US20130233508A1|2013-09-12|
    JP2013541689A|2013-11-14|
    PT2630431T|2019-08-07|
    TWI464358B|2014-12-11|
    MX2013004294A|2013-06-24|
    RU2013123287A|2014-11-27|
    EP2630431A4|2018-04-04|
    JP2015143613A|2015-08-06|
    CN103154660A|2013-06-12|
    RU2535591C1|2014-12-20|
    BR112013009053A2|2016-07-19|
    EP2630431B1|2019-05-15|
    AU2011318648B2|2014-10-02|
    TW201217741A|2012-05-01|
    EP2630431A1|2013-08-28|
    US8776866B2|2014-07-15|
    CA2814804A1|2012-04-26|
    PL2630431T3|2019-10-31|
    DK2630431T3|2019-08-19|
    BR112013009053B1|2020-04-22|
    KR20130101531A|2013-09-13|
    JP5911984B2|2016-04-27|
    CN103154660B|2015-06-17|
    WO2012053957A1|2012-04-26|
    CA2814804C|2014-09-30|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    GB2171506B|1985-02-21|1988-03-02|Apv Uk|Plate heat transfer apparatus|
    JPH02298797A|1989-05-12|1990-12-11|Mitsubishi Heavy Ind Ltd|Plate type heat exchanger|
    DE4100651A1|1991-01-11|1992-07-16|Gea Ahlborn Gmbh|Heat exchanger with double-skin panels - incorporates channels to remove leakage water|
    JPH04331339A|1991-03-27|1992-11-19|Kansai Electric Power Co Inc:The|Leak age sound detection device of heat exchanger|
    DE4402002B4|1994-01-18|2005-10-27|Wago Verwaltungsgesellschaft Mbh|I / O modules / for a data bus|
    US5615733A|1996-05-01|1997-04-01|Helio-Compatic Corporation|On-line monitoring system of a simulated heat-exchanger|
    DE19708472C2|1997-02-20|1999-02-18|Atotech Deutschland Gmbh|Manufacturing process for chemical microreactors|
    SE521916C2|1997-02-25|2003-12-16|Ep Technology Ab|Flat heat exchanger with leakage emissions|
    US6659172B1|1998-04-03|2003-12-09|Alliedsignal Inc.|Electro-hydrodynamic heat exchanger|
    JP2000092083A|1998-09-17|2000-03-31|Nissan Motor Co Ltd|On-vehicle electronic controller|
    JP2000130966A|1998-10-30|2000-05-12|Sumitomo Precision Prod Co Ltd|Plate-fin type heat exchanger|
    JP3861669B2|2001-11-22|2006-12-20|ソニー株式会社|Manufacturing method of multichip circuit module|
    JP2003163323A|2001-11-27|2003-06-06|Sony Corp|Circuit module and manufacturing method thereof|
    DE10217034B4|2002-04-11|2005-02-10|Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.|Printed circuit board fuel cell system and method of making the same|
    JP2005291521A|2004-03-31|2005-10-20|Nissan Motor Co Ltd|Multilayer evaporator|
    JP2005315498A|2004-04-28|2005-11-10|Mitsubishi Electric Corp|Refrigerating cycle device|
    SE527981C2|2004-06-04|2006-07-25|Alfa Laval Corp Ab|Method and apparatus for assessing the risk of fluid leakage in a heat exchanger with sensor|
    SE530957C2|2004-09-08|2008-11-04|Ep Technology Ab|Heat exchanger with temperature controlled valve|
    JP4533795B2|2005-05-06|2010-09-01|三菱重工業株式会社|Plate fin heat exchanger|
    JP2007079731A|2005-09-12|2007-03-29|Kume Denki Kk|Data control device|
    US20070198139A1|2006-02-21|2007-08-23|Colm Boran|Auto-address multi-sensor network|
    JP2009222400A|2008-03-13|2009-10-01|Yamatake Corp|Sensor system|
    RU2364812C1|2008-04-04|2009-08-20|Алексей Иванович Худяков|Cylindrical plate heat exchanger|
    JP4990224B2|2008-06-05|2012-08-01|岩井機械工業株式会社|Seal member for fluid product manufacturing plant equipment with RFID tag attached and method for attaching the same|
    JP2010060515A|2008-09-05|2010-03-18|Nitto Seiko Co Ltd|Leakage checking device for movable storage tank|
    SE533359C2|2008-12-16|2010-09-07|Alfa Laval Corp Ab|Plate and gasket for a plate heat exchanger|
    CH701027B1|2009-05-08|2013-08-30|Coolson Ag|Heat exchanger.|
    CN201463692U|2009-09-16|2010-05-12|四平市巨元瀚洋板式换热器有限公司|Detachable plate heat exchanger special high-effective heat transfer plate|
    SE536618C2|2010-10-22|2014-04-01|Alfa Laval Corp Ab|Heat exchanger plate and plate heat exchanger|SE536618C2|2010-10-22|2014-04-01|Alfa Laval Corp Ab|Heat exchanger plate and plate heat exchanger|
    DK2653818T3|2012-04-20|2014-11-03|Alfa Laval Corp Ab|HEAT EXCHANGER PLATE AND PLATE HEAT EXCHANGE|
    KR101640905B1|2013-12-24|2016-08-01|케이티씨 주식회사|Expandable plate pack and heat exchanger having the same|
    EP2908113B1|2014-02-18|2018-09-19|Alfa Laval Corporate AB|A probe device configured for detecting the presence of a liquid, and an apparatus comprising such a probe device|
    US9581395B2|2014-10-14|2017-02-28|Neptune-Benson, Llc|Multi-segmented tube sheet|
    KR102050139B1|2017-12-12|2019-11-28|주식회사 이노윌|Primary Surface Heat Exchanger having Improved Internal Pressure and Manufacturing Method Thereof and Heat Exchange System|
    US10914652B2|2018-05-31|2021-02-09|Wcr, Inc.|Leak detection for heat exchanger plate|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1051101A|SE535236C2|2010-10-22|2010-10-22|Heat exchanger plate and plate heat exchanger|SE1051101A| SE535236C2|2010-10-22|2010-10-22|Heat exchanger plate and plate heat exchanger|
    AU2011318648A| AU2011318648B2|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    PL11834714T| PL2630431T3|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    PT11834714T| PT2630431T|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    MX2013004294A| MX2013004294A|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger.|
    RU2013123287/06A| RU2535591C1|2010-10-22|2011-10-03|Heat exchange plate and plate heat exchanger|
    DK11834714.5T| DK2630431T3|2010-10-22|2011-10-03|HEAT EXCHANGER PLATE AND PLATE HEAT EXCHANGE|
    ES11834714T| ES2739895T3|2010-10-22|2011-10-03|Heat exchanger plate and plate heat exchanger|
    KR1020137010023A| KR101453232B1|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    CA2814804A| CA2814804C|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    EP11834714.5A| EP2630431B1|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    CN201180050907.3A| CN103154660B|2010-10-22|2011-10-03|Heat exchanger plate and plate heat exchanger|
    PCT/SE2011/051175| WO2012053957A1|2010-10-22|2011-10-03|A heat exchanger plate and a plate heat exchanger|
    BR112013009053A| BR112013009053B1|2010-10-22|2011-10-03|plate heat exchanger for a plate heat exchanger, and, plate heat exchanger|
    JP2013534854A| JP2013541689A|2010-10-22|2011-10-03|Heat exchanger plate and plate heat exchanger|
    US13/880,828| US8776866B2|2010-10-22|2011-10-03|Heat exchanger plate and a plate heat exchanger|
    TW100137673A| TWI464358B|2010-10-22|2011-10-18|A heat exchanger plate and a plate heat exchanger|
    JP2015041427A| JP5911984B2|2010-10-22|2015-03-03|Heat exchanger plate and plate heat exchanger|
    [返回顶部]